Izixazululo

UKUBOPHELA NGOCINGO

ISHIDI LAMAQINISO ASESEKELWE NGOLWAZI

Kuyini Ukubopha Ngentambo?

Ukubopha ngentambo kuyindlela lapho intambo yensimbi ethambile enobude obuncane ububanzi ixhunywa ngayo endaweni yensimbi ehambisanayo ngaphandle kokusebenzisa i-solder, i-flux, futhi kwezinye izimo kusetshenziswa ukushisa okungaphezu kwama-degree Celsius angu-150. Izinsimbi ezithambile zifaka iGolide (Au), iCopper (Cu), iSilver (Ag), iAluminium (Al) kanye nama-alloys afana nePalladium-Silver (PdAg) nezinye.

Ukuqonda Amasu Nezinqubo Zokubopha Izintambo Zezicelo Zokuhlanganisa Ama-Micro Electronics.
Amasu / Izinqubo Zokubopha Ama-Wedge: I-Ribbon, i-Thermosonic Ball kanye ne-Ultrasonic Wedge Bond
Ukubopha ngentambo kuyindlela yokwenza ukuxhumana phakathi kwesekethe ehlanganisiwe (i-IC) noma idivayisi efanayo ye-semiconductor kanye nephakheji noma ifreyimu yayo ngesikhathi sokukhiqiza. Isetshenziswa kakhulu manje ukuhlinzeka ngokuxhumeka kukagesi kuma-assembly e-Lithium-ion battery pack. Ukubopha ngentambo ngokuvamile kubhekwa njengokusebenza kahle kakhulu futhi okuguquguqukayo kobuchwepheshe bokuxhumana be-microelectronic obutholakalayo, futhi kusetshenziswa kumaphakheji amaningi e-semiconductor akhiqizwa namuhla. Kunezindlela eziningana zokubopha ngentambo, ezihlanganisa: Ukubopha Ngentambo Okucindezelwe Nge-Thermo-Compression:
Ukubopha ngentambo yokucindezela ngokushisa (okuhlanganiswe ezindaweni ezingaba khona (ngokuvamile i-Au) ndawonye ngaphansi kwamandla okubopha anamazinga okushisa aphezulu esibonakalayo, ngokuvamile angaphezu kuka-300°C, ukukhiqiza i-weld), kwaqalwa ukwakhiwa ngawo-1950 ukuze kuhlanganiswe nge-microelectronics, nokho lokhu kwathathelwa indawo ngokushesha yi-Ultrasonic & Thermosonic bonding ngawo-1960 njengobuchwepheshe obuphambili bokuxhuma. Ukubopha ngentambo yokucindezela ngokushisa kusasetshenziswa ezinhlelweni zokusebenza ezikhethekile namuhla, kodwa ngokuvamile kugwenywa abakhiqizi ngenxa yamazinga okushisa aphezulu (avame ukulimaza) esibonakalayo adingekayo ukuze kwenziwe isibopho esiphumelelayo. Ukubopha Ngentambo Yokucindezela Ngokushisa ...
Ngawo-1960, ukubopha intambo ye-Ultrasonic wedge kwaba yindlela eyinhloko yokuxhumanisa. Ukusetshenziswa kokudlidliza okuvamise kakhulu (nge-transducer ephendulayo) kuthuluzi lokubopha ngamandla okubopha ngesikhathi esisodwa, kwavumela izintambo ze-Aluminium nezeGolide ukuthi zifakwe ekushiseni kwegumbi. Lokhu kudlidliza kwe-Ultrasonic kusiza ekususeni ukungcola (ama-oxide, ukungcola, njll.) ezindaweni zokubopha ekuqaleni komjikelezo wokubopha, kanye nasekukhuthazeni ukukhula kwe-intermetallic ukuze kuthuthukiswe futhi kuqiniswe isibopho. Amaza ajwayelekile okubopha angama-60 - 120 KHz. Indlela ye-ultrasonic wedge inobuchwepheshe obubili obuyinhloko benqubo: Ukubopha intambo okukhulu (okusindayo) kwezintambo ezinobubanzi obungu->100µm Ukubopha intambo okuncane (okuncane) kwezintambo ezinobubanzi obungu-<75µm Izibonelo zemijikelezo ejwayelekile yokubopha ye-Ultrasonic zingatholakala lapha ngocingo oluncane kanye nalapha ngocingo olukhulu. Ukubopha intambo ye-Ultrasonic wedge kusebenzisa ithuluzi elithile lokubopha noma "i-wedge," evame ukwakhiwa nge-Tungsten Carbide (yocingo lwe-Aluminium) noma i-Titanium Carbide (yocingo lweGolide) kuye ngezidingo zenqubo kanye nobubanzi bentambo; Kukhona nama-wedge anezinti ze-ceramic zezinhlelo zokusebenza ezahlukene. I-Thermosonic Wire Bonding:
Lapho kudingeka khona ukufudumeza okwengeziwe (ngokuvamile ngentambo yegolide, enezixhumanisi zokubopha ezibangeni lika-100 - 250°C), inqubo ibizwa ngokuthi i-Thermosonic wire bonding. Lokhu kunezinzuzo ezinkulu kunesistimu yendabuko yokucindezela ukushisa, njengoba kudingeka amazinga okushisa aphansi kakhulu esibonakalayo (Kuye kwakhulunywa ngokubopha kwe-Au ekushiseni kwegumbi kodwa empeleni akuthembekile ngaphandle kokushisa okwengeziwe). I-Thermosonic Ball Bonding:
Olunye uhlobo lokubopha ucingo lwe-Thermosonic yi-Ball Bonding (bheka umjikelezo wokubopha ibhola lapha). Le ndlela isebenzisa ithuluzi lokubopha i-capillary le-ceramic phezu kwemiklamo yendabuko ye-wedge ukuhlanganisa izimfanelo ezinhle kakhulu kokubili ekucindezelweni kwe-thermo kanye nokubopha kwe-ultrasonic ngaphandle kwezihibe. Ukudlidliza kwe-Thermosonic kuqinisekisa ukuthi izinga lokushisa le-interface lihlala liphansi, kuyilapho ukuxhumana kokuqala, isibopho sebhola esicindezelwe ngokushisa sivumela ucingo kanye nesibopho sesibili ukuthi kubekwe kunoma iyiphi indlela, hhayi ku-bond yokuqala, okuyisithiyo ekuboshweni kwentambo ye-Ultrasonic. Ekukhiqizweni okuzenzakalelayo, okuphezulu, ama-bond ebhola ashesha kakhulu kune-Ultrasonic / Thermosonic (Wedge), okwenza i-Thermosonic ball bonding ibe ubuchwepheshe obuphezulu bokuxhumanisa kuma-microelectronics eminyakeni engaphezu kwengu-50 edlule.
Ukubopha iribhoni, kusetshenziswa amateyipu ensimbi ayisicaba, bekulokhu kubusa kuma-electronics e-RF kanye ne-Microwave amashumi eminyaka (iribhoni ihlinzeka ngokuthuthuka okukhulu ekulahlekelweni kwesiginali [umphumela wesikhumba] uma kuqhathaniswa nocingo oluyindilinga olujwayelekile). Amaribhoni Amancane Egolide, ngokuvamile afinyelela ku-75µm ububanzi kanye no-25µm ubukhulu, ahlanganiswa ngenqubo ye-Thermosonic ngethuluzi elikhulu lokubopha i-wedge elinobuso obuyisicaba. Amaribhoni e-aluminium afinyelela ku-2,000µm ububanzi kanye no-250µm ubukhulu nawo angahlanganiswa ngenqubo ye-Ultrasonic wedge, njengoba isidingo se-loop ephansi, ukuxhumana okuphezulu kwabantu sikhulile.

Iyini intambo yokubopha yegolide?

Ukubopha ucingo lwegolide inqubo lapho ucingo lwegolide luxhunywa khona ezindaweni ezimbili emhlanganweni ukuze kwakheke ukuxhumana noma indlela eqhuba ugesi. Ukushisa, ama-ultrasonic, kanye namandla konke kusetshenziswa ukwakha izindawo zokunamathisela ucingo lwegolide. Inqubo yokwakha indawo yokunamathisela iqala ngokwakhiwa kwebhola legolide esicongweni sethuluzi lokubopha ucingo, i-capillary. Leli bhola licindezelwa ebusweni bomhlangano obufudumele ngenkathi kusetshenziswa kokubili inani lamandla eliqondene nohlelo kanye nemvamisa engu-60kHz - 152kHz yokunyakaza kwe-ultrasonic nethuluzi. Uma isibopho sokuqala senziwe, ucingo luzophathwa ngendlela elawulwa kahle ukuze kwakheke isimo seluphu esifanele se-geometry yenhlangano. Isibopho sesibili, esivame ukubizwa ngokuthi ukuthunga, sakhiwa kolunye uhlangothi ngokucindezela phansi ngentambo bese kusetshenziswa i-clamp ukudabula ucingo esibophweni.

Ukubopha ucingo lwegolide kunikeza indlela yokuxhuma ngaphakathi kwamaphakheji aqhuba ugesi kakhulu, cishe ngobukhulu obukhulu kunezinye izihlanganisi. Ngaphezu kwalokho, izintambo zegolide zinokubekezelela okuphezulu kokubola uma kuqhathaniswa nezinye izinto zocingo futhi zithambile kuneziningi, okubalulekile ezindaweni ezibucayi.
Le nqubo ingahluka futhi ngokusekelwe ezidingweni zokuhlanganiswa. Ngezinto ezibucayi, ibhola legolide lingabekwa endaweni yesibili yokubopha ukuze kudalwe isibopho esiqinile kanye nesibopho "esithambile" ukuvimbela umonakalo ebusweni bengxenye. Ngezikhala eziqinile, ibhola elilodwa lingasetshenziswa njengendawo yokuqala yezibopho ezimbili, kwakhiwe isibopho esimise okwe-"V". Lapho isibopho sentambo sidinga ukuqina kakhudlwana, ibhola lingabekwa phezu kwesithungo ukuze kwakhiwe isibopho sokuphepha, okwandisa ukuzinza namandla entambo. Izinhlelo zokusebenza eziningi ezahlukene kanye nokuhlukahluka kokubopha ngentambo cishe kungenamkhawulo futhi kungafezwa ngokusebenzisa isofthiwe ezenzakalelayo ezinhlelweni zezibopho zentambo zikaPalomar.